At this stage, traditional mobile phone cooling solutions are difficult to meet the cooling requirements of AI mobile phones alone. The cooling combination based on VC and supplemented by graphite and graphene will become the mainstream cooling solution.
Haitong Research published a research report stating that the computing speed and data processing capabilities of AI mobile phones continue to improve, and the heat generation continues to increase. At the same time, the heat dissipation space of mobile phones is limited, and there is an urgent need for a heat dissipation solution with higher efficiency and value. The heat dissipation solution has gradually evolved from the initial graphite sheet to heat pipes, VC, and 3D VC. The mobile phone chip temperature equalization technology has achieved a transformation from one-dimensional to two-dimensional and then to three-dimensional integrated. At this stage, traditional mobile phone heat dissipation solutions are difficult to meet the heat dissipation requirements of AI mobile phones alone. The heat dissipation combination with VC as the main and graphite and graphene as the auxiliary will become the mainstream heat dissipation solution, and the growth rate of the mobile phone heat dissipation industry is expected to increase.
Driven by the improvement of AI computing power and the trend of thinner and lighter mobile phones, mobile phone cooling solutions have shifted from traditional heat pipes and VC to more innovative VC+graphene combinations and 3D VC, and the growth rate of the mobile phone cooling industry is expected to increase.
The demand for innovative cooling solutions is increasing: due to the contradiction between power consumption and cooling space, cooling technology still needs to be updated. The computing speed and data processing capabilities of AI mobile phones continue to improve, and the heat generation continues to increase. At the same time, the cooling space of mobile phones is limited, and a cooling solution with higher efficiency and value is urgently needed.
Analysis of mainstream heat dissipation solutions: from graphite to VC, from single material to combination solutions. The heat dissipation solution has gradually evolved from the initial graphite sheet to heat pipes, VC, and 3D VC. The temperature equalization technology of mobile phone chips has achieved a transformation from one-dimensional to two-dimensional and then to three-dimensional integration. At this stage, traditional mobile phone heat dissipation solutions are difficult to meet the heat dissipation requirements of AI mobile phones alone. The heat dissipation combination with VC as the main material and graphite and graphene as the auxiliary material will become the mainstream heat dissipation solution.
Risk warning: New technology advancement is slower than expected, major customers’ cooling solution selection, and industry competition intensifies risks.